Munich Area, Germany
Project Manager Codesign & Packaging Development
Semiconductors
Education
Imperial College London 2001 — 2002
MSc, Composite Materials
The University of Sheffield 1999 — 2001
BEng, Chemical and Process Engineering
Foon Yew High School 1993 — 1999
Science
Experience
Intel Corporation July 2012 - Present
NXP Semiconductors August 2009 - July 2012
NXP Semiconductors August 2007 - July 2009
University of Cambridge October 2006 - June 2007
Intel April 2003 - September 2006
Skills
Problem Solving, Root Cause Analysis, Project Management, Product Development, Automotive, Technology Development, Semiconductor..., Product Engineering, Minitab, Assembly, Lean Manufacturing, FMEA, Process Improvement, Team Building, Failure Analysis, Quality Management, Co-design, Cost Reduction, Teamwork, Supplier Management, Green Belt, Thin Films, Process Simulation, Engineering, JMP, Time Management, Technology Transfer, Sensors, Continuous Improvement, Materials Science, Six Sigma, Manufacturing, Semiconductors, Characterization, Customer Relations, R&D, Team Leadership, IC, ISO, Change Management, Packaging, Supply Management, Process Development, Materials, PMP