Nürnberg, Bayern, Germany
R&D Engineer
Automotive
Education
Technische Universität Dresden 2010 — 2014
Electrical Engineering, Electromechanical and electronic design, electronic packaging, Master of Science in Electrical Engineering
Universitatea „Politehnica” din București 2007 — 2010
Electrical Engineering, Bachelor
Experience
Continental May 2014 - Present
3D Systems Packaging Research Center @ GT October 2012 - March 2013
Anvilex, GmbH May 2012 - September 2012
Skills
Organic interposer..., Interposer reliability, 3D Cad Design, PCB Design, Polymers, environmental and..., Manufacturing, Project Management, PCB manufacturing, Semiconductors, Glass interposer..., Tanner Tools, Product Development, PCB design, Testing, Galvanic plating, Eless Plating, Autodesk Inventor, CAD, Forschung und..., Chip assembley, Metal Fabrication, Electronic Circuit..., Eagle PCB, Interposer design, Altium Designer, Automotive, R&D, LabVIEW, Layout Design, Materials, Leadership, PCB reliability, Components, Passives integration, Cross Sections, Electronics, Strategic Planning, Clean room experience, 3D die integration