Geneva Area, Switzerland
Global Product Support Engineer, Precision Wafering Systems at Applied Materials, Switzerland
Renewables & Environment
Education
Polytech'Orléans 1995 — 1996
DEA, Plasma Processing
Polytech'Orléans 1993 — 1996
Engineer ESPEO, Photonics-Lasers and Plasma Processing
Experience
Applied Materials, Switzerland December 2010 - Present
Applied Materials, Spain January 2008 - November 2010
Applied Materials, Switzerland July 2010 - July 2010
Applied Materials, France March 2007 - December 2007
Applied Materials, France April 2004 - March 2007
Applied Materials, France December 2000 - April 2004
Applied Materials, France January 1999 - December 2000
Applied Materials, France September 1997 - December 1998
Armée de Terre October 1996 - July 1997
Skills
Project Management, Customer Relations, Electronics, Problem Solving, Six Sigma, KPI, Solar PV, CIP, Characterization, Process Improvement, Lean Manufacturing, Manufacturing, RCA, Wafering, Troubleshooting, Customer Experience, Cost Control, DFX, Root Cause Analysis, Technical Writing, Process Engineering, Product Life Cycle, Wire Saw, Semiconductors, Product Development, Technical Documentation, Process Simulation, Failure Analysis, Metrology, Benchmarking, Semiconductor Equipment, Etching, Customer Service, Design of Experiments, CVD, Vacuum, Technical Support, DOE, Technical Training, Continuous Improvement, PECVD, FA, Preventive Maintenance, Semiconductor Industry, Thin Films, FMEA, PVD, Engineering, PLC, Key Performance...